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The AMD BS50 chipset makes PCIe 4 0 possible foe anyone who wants higher performance, bandwidth and speed. Ready for 3rd Gen AMD Ryzen" processors and beyond.
Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.
This motherboard features onboard RGB headers and an addressable RGB header that allow motherboard to be connected to compatible LED devices such as strip, CPU fans, coolers, chassis and so on. Users may also synchronize RGB LED devices across the Polychrome RGB Sync-certified accessories to create their own unique lighting effects.
No one has time for weak WiFi signals and sluggish internet! That's why this motherboard comes with an exclusive 2T2R 802.11ac WiFi (2.4G / 5G WiFi) module that supports up to 867Mbps wireless networks and Bluetooth v4.2. Experience up to 289% speed boost compared to your old WiFi!
Supports the next generation PCI Express 4.0 M.2 SSDs, it is capable of perform twice the speed compared to previous 3rd generation, giving a lightning fast data transferring experience.
Good M.2 SSD protection is important for longevity and stability. ASRock provides a completed M.2 armor solution that makes SSDs to run in a certain low temperature.
This motherboard has a pair of onboard Type-A and Type-C USB 3.2 Gen1 ports built on the rear i/o for supporting next generation USB 3.2 Gen1 devices and to deliver up to 5 Gbps data transfer rates.
Complete with two types of most used connectors! Packed with a HDMI + DisplayPort combo, you have more graphics output options now.
Supports the most recent HDMI 4K 60Hz graphics output specification. With the larger bandwidth and increased frame rate, the motion on your screen becomes more fluid and less blurry.
Compared to traditional chokes, ASRock's premium 60A power chokes effectively make the saturation current up to three times better, thus providing enhanced and improved Vcore voltage to the motherboard.
Dr. MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Intelligently delivering higher current and driving up to 50A continuous current for each phase, thus providing improved thermal result and superior performance.
Pure black PCB appearance. The new Sapphire Black PCB represents rock-solid quality and gives the motherboard a more mysterious touch.
High Density Glass Fabric PCB design that reduces the gaps between the PCB layers to protect the motherboard against electrical shorts caused by humidity.
Some sensitive digital components on the motherboard are vulnerable to power surges, the excessive current may cause your system to malfunction immediately. ASRock Full Spike Protection includes various technologies to prevent your motherboard's components from being damaged by these unexpected voltage spikes.
ASRock Live Update & APP Shop is designed for your convenience. ASRock provides various apps and support software for users to download. You can also easily optimize your system and keep your motherboard up to date with ASRock Live Update & APP Shop.
JumperFree, SMBIOS 2.3-støtte, UEFI BIOS, ACPI 5,1 støtte
Overvåking av maskinvare
CPU-kjernetemperatur, chassis-temperatur, viftehastighet for CPU, viftehastighet for chassis, systemspenning, Kjernespenning CPU
Wake on LAN (WOL)
8 Phase Power Design, ASRock Instant Flash, HDCP-samsvar, 15µ Gold Contact, Digi Power Design, ESD Protection, Energy Efficient Ethernet 802.3az, Preboot eXecution Environment (PXE), ASRock Full Spike Protection, ASRock APP Shop, ASRock Super Alloy, High Density Glass Fabric PCB, ASRock Full HD UEFI, Sapphire Black PCB, Dr.MOS MOSFET, ASRock Live Update, ASRock Full Coverage M.2 Heatsink, ASRock Hyper M.2
I/O-bakplate, 2 x ASRock WiFi 2.4/5GHz Antennas
2 x Seriell ATA-kabel
Drivers & Utilities, ASRock A-Tuning, Antivirus (prøveversjon), Google Chrome Browser, Google ChromeToolbar, ASRock XFast LAN, ASRock Polychrome SYNC
Plug and Play, FCC, EuP Ready, ErP Ready, HDCP 2.3